JUKI2050 placement machine is suitable for high-speed placement of small components
A single module as a modular concept can form a flexible placement machine production line according to production capacity.
■ 13,200CPH: chip (laser recognition / actual production efficiency)
■ Laser placement head × 1 (4 suction nozzles)
■ 0603 (English 0201) chip ~ 20mm square component, or 26.5×11mm
0402 (Imperial 01005) chip is an option when leaving the factory
※1 There are differences depending on the mounting speed conditions
While inheriting the advantages of KE series products, the placement speed has been greatly improved. In addition, this machine adopts the newly developed high-speed tray server, which can shorten the tray replacement time, so it can greatly increase the speed of tray supply components, thereby achieving the goal of improving production efficiency
Specifications of JUKI2050 placement machine:
13,200CPH: chip (laser recognition / actual production efficiency)
Laser placement head × 1 (4 suction nozzles)
0603 (Inch 0201) chip ~ 20mm square component, or 26.5×11mm
0402 (Imperial 1005) chip is an option when leaving the factory
There are differences in mounting speed conditions
Substrate size
For M board (330×250mm)
For L board (410×360mm)
Lwide(510×360mm)
For E board (510×460mm)*1
Component size
Laser recognition: 0603 chip (English 0201) chip ~ 20mm square component or 26.5×11mm (0402 (English 01005) chip requires option)*5
Component placement speed: chip components 13,200CPH*2
Component placement accuracy: laser recognition ± 0.05mm
Component mounting types: up to 80 types (converted to 8mm tape)
Device size*3 (W×D×H*4): 1,400×1,393×1,440mm
Approximate weight: 1400kg
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