ETON HT-F9 Magnetic levitation high-speed placement machine Pick&Place machine

Main parameters of CM202 placement machine: 2004 equipment PCB size: 460mm×360mm Component range that can be attached: 0201 to 24mmQFPS Material station: 104 Theoretical placement speed: 0.088s/chip 40909 pieces/hour Mounting accuracy: ±0.05mm Dimensions and Weight: 2,350(L) X 1,950(D) X 1,430(H)mm&2,800kg Power supply and air source: 3P/200V±10V/3KVa

Model name: CM402-L Substrate size: L50mm×W50mm～L510mm×W460mm Substrate replacement time: 0.9s (when the substrate length is below 240mm and under the best conditions) Power supply*1: three-phase AC200V, 3.5kVA Air pressure source*2: 0.49MPa, 150L/min (A.N.R.) Equipment size: W2350mm×D2690mm×H1430mm*3 Weight*4: 3000kg   High-speed placement head Mounting fastest speed: 0.06s/chip (Type A) Mounting accuracy: ±50μm/chip (Cpk≧1) Component size: 0603 chip~L24mm×W24mm   Multifunctional placement head Mounting fastest speed: 0.21s/QFP (Type B) Mounting accuracy: ±35μm/QFP (Cpk≧1) Component size: 0603 chip~L100mm×W90mm

Panasonic's BM231 modular high-speed multi-function placement machine has any volume, any mix capability by placing various components from 0402 (01005) microchips to BGAs, CSPs and connectors. Maximum productivity is achieved through uninterrupted operation and quick changeovers.

The Panasonic Mounter NPM-TT2 is a line configuration capable of achieving both high productivity per unit area and versatility *When directly connecting the NPM-W2, an M-size double-track conveyor belt (optional) is required. The placement head (8-nozzle placement head, 3-nozzle placement head - you can choose the general-purpose 8-nozzle placement head or the 3-nozzle placement head with special-shaped component capability) The specification of the supply part can be selected .change. By reorganizing the tray feeder/exchange trolley, the line configuration can be adapted to the component supply form. Using a multi-functional recognition camera, the recognition and inspection of the height direction of the components can be realized at a high speed, and it can carry out stable and high-speed mounting of special-shaped components) Alternate mounting and independent mounting correspondence ——(can choose the best mounting method corresponding to the production substrate)