Yadis YDS-W20 Wire Less Placement Machine Pick&Place machine
YDS-W20 Wire Less Placement Machine
Features:
1. It is suitable for 5M to infinitely long flexible light strips and light bars. The machine adopts double-head, three-material station or four-material station, with 16 nozzles in each group.
2. The whole body adopts precision welding, and the beam adopts high cast iron structure.
3. The machine adopts imported servo motor drive, with high precision and fast speed.
4. Low maintenance costs and simple speculation. Operators only need to undergo simple training to go online.
5. The machine adopts double electric feeder for feeding.
Description
Shipping & Delivery
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Correspondingly, on a large substrate of 750×550 mm, the component range is also expanded to L150×W25×T30mm
3. Double-track installation (select specifications) to achieve high productivity per unit area
According to the production substrate, you can choose independent mounting, alternate mounting, mixed mounting and other mounting methods
Panasonic Mounter CM402-L Modular Super High Speed placement machine
Model name: CM402-L
Substrate size: L50mm×W50mm～L510mm×W460mm
Substrate replacement time: 0.9s (when the substrate length is below 240mm and under the best conditions)
Power supply*1: three-phase AC200V, 3.5kVA
Air pressure source*2: 0.49MPa, 150L/min (A.N.R.)
Equipment size: W2350mm×D2690mm×H1430mm*3
Weight*4: 3000kg
High-speed placement head
Mounting fastest speed: 0.06s/chip (Type A)
Mounting accuracy: ±50μm/chip (Cpk≧1)
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Multifunctional placement head
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Mounting accuracy: ±35μm/QFP (Cpk≧1)
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- Fly: 0402 ~ □21 mm / Fix: ~□42 mm (Standard) / ~□55 mm (MFOV) / ~ L75 mm Connector (MFOV)
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Yamaha 3D Hybrid Modular S10/S20 Mounter placement machine
Specifications
| S10 | S20 | |
|---|---|---|
| Board size(with buffer unused) | Min. L50 x W30mm to Max. L1,330 x W510mm (Standard L955) | Min. L50 x W30mm to Max. L1,830 x W510mm (Standard L1,455) |
| Board size(with input or output buffer used) | Min. L50 x W30mm to Max. L420 x W510mm | - |
| Board size(with input and output buffers used) | Min. L50 x W30mm to Max. L330 x W510mm | Min. L50 x W30mm to Max. L540 x W510mm |
| Board thickness | 0.4 - 4.8mm | 0.4 - 4.8mm |
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| Board transfer speed | Max 900mm/sec | Max 900mm/sec |
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| Placement accuracy A (μ+3σ) | CHIP +/-0.040mm | CHIP +/-0.040mm |
| Placement accuracy B (μ+3σ) | IC +/-0.025mm | IC +/-0.025mm |
| Placement angle | +/-180 degrees | +/-180 degrees |
| Z axis control / Theta axis control | AC servo motor | AC servo motor |
| Component height | Max 30mm*1 (Pre-placed components: max 25mm) | Max 30mm*1 (Pre-placed components: max 25mm) |
| Applicable components | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) |
| Component package | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray |
| Drawback check | Vacuum check and vision check | Vacuum check and vision check |
| Screen language | English, Chinese, Korean, Japanese | English, Chinese, Korean, Japanese |
| Board positioning | Board grip unit, front reference, auto conveyor width adjustment | Board grip unit, front reference, auto conveyor width adjustment |
| Component types | Max 90 types (8mm tape), 45 lanes x 2 | Max 180 types (8mm tape), 45 lanes x 4 |
| Transfer height | 900 +/- 20mm | 900 +/- 20mm |
| Machine dimensions, weight | L1250xD1750xH1420mm, Approx. 1,200kg | L1750xD1750xH1420mm, Approx. 1,500kg |
- *1 :
- Board thickness + Component height = Max 30mm
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Main parameters of CM202 placement machine:
2004 equipment
PCB size: 460mm×360mm
Component range that can be attached: 0201 to 24mmQFPS
Material station: 104
Theoretical placement speed: 0.088s/chip 40909 pieces/hour
Mounting accuracy: ±0.05mm
Dimensions and Weight: 2,350(L) X 1,950(D) X 1,430(H)mm&2,800kg
Power supply and air source: 3P/200V±10V/3KVa
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