JUTZE online automatic 3D SPI Mirage

Special features: 3D high-precision contour measurement technology perfect application Applicable substrate: 50mm x 70mm-510mm x 460mm Substrate thickness: 0.6mm-6.0mm Resolution:

Sinic-Tek SPI In-line 3D Solder Paste Inspection Model: S8080

TECHNICAL PARAMETERS: Inspection Principle: Programmable phase contour modulation measurement techniques(PSLM PMP) Inspection type:Volume, area, height, XY offset, shape, etc. Defect Types:shift,