JUKI multifunctional high-speed placement machine KE2080
Substrate size
For M substrate (330×250mm) ○
For L substrate (410×360mm) ○
L-wide(510×360mm) ○
For E board (510×460mm)*1 ○
Component size
Laser recognition 0402 (English 01005) chip ~ 33.5mm square component
Image recognition 1.0×0.5mm*2~74mm square component
or 50×150mm
Component placement speed
Chip components Best condition 0.178 seconds/chip (20,200CPH)
IPC9850 16,700CPH
IC components*3 1,850CPH
4,600CPH*4
Component placement accuracy
Laser recognition ±0.05mm (Cpk≧1)
Image recognition ±0.03mm (±0.04mm when using MNVC (optional))
Component Mounting Type
Up to 80 types (converted to 8mm
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