Equipment detailed parameter introduction: JUKI placement machine KE-2060
Working head: multi-laser placement head*1 (4 suction nozzles) high-resolution visual placement head*1 (1 suction nozzle)
Substrate size mm: 330*250mm
410*360mm
510*360mm
510*460mm
Component height: 0603 (English 0201) chip-74mm square component or 50*150mm component (laser recognition, image recognition)
Image recognition: reflection type, transmission type recognition, seeking recognition, segmentation recognition
Component placement speed: 12500CPH
IC: 1850CPH
MNVC:3400CPH
Mounting accuracy: plus or minus 0.05mm
Image: plus or minus 0.03mm
Number of component material stations: 80 stations (converted into 8mm tape)
Description
Shipping & Delivery
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Hanwha High Speed General Mounter DECAN L2
Specifications
- Alignment
- Fly Camera, Fix Camera
- Spindle & Speed
- 2 Gantry * 6 Spindle / 56,000 CPH
- Accuracy
- ±40µm Cpk≥1.0 (0402 (01005 inch) chip) /±30µm Cpk≥1.0 (IC, Stage Vision)
- Component Range
- Fly: 0402 ~ □21 mm / Fix: ~□42 mm (Standard) / ~□55 mm (MFOV) / ~ L75 mm Connector (MFOV)
- Dimension
- L 1,430 x D 1,740 x H 1,995
Super High Efficiency Dual Lane Modular YRM20DL Mounter placement machine
Specifications
| Model | YRM20 | ||
|---|---|---|---|
| Super high-speed rotary RM head | High-speed general-purpose in-line HM head | Odd-shaped components in-line FM (flexible-multi) head | |
| Nozzles (per 1 head unit) | 18 | 10 | 5 |
| Applicable components | 0201mm to W12 x L12mm, Height 6.5mm or less | 0201mm to W55 x L100mm, Height 15mm or less | 03015mm to W55 x L100mm, Height 30mm or less |
| Mounting capability (under optimum conditions) | 120,000CPH Note 1 | 100,000CPH Note 1 | 35,000CPH |
| Mounting accuracy (under optimum conditions) | ±0.015mm Cpk≧1.0 Note 2 | ±0.035mm Cpk≧1.0 | |
| Number of component types | Feeder carriage exchange : Max. 128 types = 32 feeders x 4 (conversion for 8mm tape feeder) Fixed plate : Max. 128 types (conversion for 8mm tape feeder), Trays : 60 types (maximum when equipped with eATS30 x 2) | ||
| PCB dimensions | Single use : L50 x W50mm to L810 x W610mm Dual use : L50 x W50mm to L810 x W330mm | ||
| Power supply | 3-Phase AC 200/208/220/240/380/400/416V +/-10% 50/60Hz | ||
| Air supply source | 0.45MPa or more, in clean, dry state | ||
| External dimension (excluding projections) | L1,374 x W2,102 x H1,445mm | ||
| Weight | Approx. 2,550kg (Main unit only) | ||
Yamaha 3D Hybrid Modular S10/S20 Mounter placement machine
Specifications
| S10 | S20 | |
|---|---|---|
| Board size(with buffer unused) | Min. L50 x W30mm to Max. L1,330 x W510mm (Standard L955) | Min. L50 x W30mm to Max. L1,830 x W510mm (Standard L1,455) |
| Board size(with input or output buffer used) | Min. L50 x W30mm to Max. L420 x W510mm | - |
| Board size(with input and output buffers used) | Min. L50 x W30mm to Max. L330 x W510mm | Min. L50 x W30mm to Max. L540 x W510mm |
| Board thickness | 0.4 - 4.8mm | 0.4 - 4.8mm |
| Board flow direction | Left to right (Std) | Left to right (Std) |
| Board transfer speed | Max 900mm/sec | Max 900mm/sec |
| Placement speed (12 heads + 2 theta) Opt. Cond. | 0.08sec/CHIP (45,000CPH) | 0.08sec/CHIP (45,000CPH) |
| Placement accuracy A (μ+3σ) | CHIP +/-0.040mm | CHIP +/-0.040mm |
| Placement accuracy B (μ+3σ) | IC +/-0.025mm | IC +/-0.025mm |
| Placement angle | +/-180 degrees | +/-180 degrees |
| Z axis control / Theta axis control | AC servo motor | AC servo motor |
| Component height | Max 30mm*1 (Pre-placed components: max 25mm) | Max 30mm*1 (Pre-placed components: max 25mm) |
| Applicable components | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) |
| Component package | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray |
| Drawback check | Vacuum check and vision check | Vacuum check and vision check |
| Screen language | English, Chinese, Korean, Japanese | English, Chinese, Korean, Japanese |
| Board positioning | Board grip unit, front reference, auto conveyor width adjustment | Board grip unit, front reference, auto conveyor width adjustment |
| Component types | Max 90 types (8mm tape), 45 lanes x 2 | Max 180 types (8mm tape), 45 lanes x 4 |
| Transfer height | 900 +/- 20mm | 900 +/- 20mm |
| Machine dimensions, weight | L1250xD1750xH1420mm, Approx. 1,200kg | L1750xD1750xH1420mm, Approx. 1,500kg |
- *1 :
- Board thickness + Component height = Max 30mm
- Specifications and appearance are subject to change without prior notice.
Panasonic NPM-W2 Multifunctional Mounter placement machine
Product Features of Panasonic NPM-W2 Multi-Function Mounter
1. Install & inspect a complete system to achieve efficient and high-quality production
To match the actual installation requirements, you can choose high-yield or high-precision mode
2. Can correspond to larger substrates and large components
Correspondingly, on a large substrate of 750×550 mm, the component range is also expanded to L150×W25×T30mm
3. Double-track installation (select specifications) to achieve high productivity per unit area
According to the production substrate, you can choose independent mounting, alternate mounting, mixed mounting and other mounting methods
Panasonic Mounter CM402-L Modular Super High Speed placement machine
Model name: CM402-L
Substrate size: L50mm×W50mm～L510mm×W460mm
Substrate replacement time: 0.9s (when the substrate length is below 240mm and under the best conditions)
Power supply*1: three-phase AC200V, 3.5kVA
Air pressure source*2: 0.49MPa, 150L/min (A.N.R.)
Equipment size: W2350mm×D2690mm×H1430mm*3
Weight*4: 3000kg
High-speed placement head
Mounting fastest speed: 0.06s/chip (Type A)
Mounting accuracy: ±50μm/chip (Cpk≧1)
Component size: 0603 chip~L24mm×W24mm
Multifunctional placement head
Mounting fastest speed: 0.21s/QFP (Type B)
Mounting accuracy: ±35μm/QFP (Cpk≧1)
Component size: 0603 chip~L100mm×W90mm
Samsung Hanwha High Speed Mounter DECANS2
Specifications
- Alignment
- Fly Camera, Fix Camera
- Spindle & Speed
- 2 Gantry * 10 Spindle / 92,000 CPH
- Accuracy
- ±28 μm @ Cpk ≥ 1.0 (03015 Chip) / ±25 μm @ Cpk ≥ 1.0(IC)
- Component Range
- Fly: 03015 ~ □12 mm / Fix: ~□42 mm (Standard) / ~□55 mm (MFOV) / ~ L75 mm Connector (MFOV)
- Dimension
- L 1,430 x D 1,740 x H 1,995
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