JUKI placement pick and palce machine 2070 Mounter

JUKI placement machine 2070
chip components
23,300CPH (laser identification / best condition) (0.155 seconds / chip)
18,300CPH (laser identification / IPC9850)

IC components
4,600CPH (image recognition / when using the MNVC option)

Laser placement head × 1 (6 nozzles)

0402 (Inch 01005) chip ~ 33.5mm square component

Image recognition (with MNVC option: reflective/transmissive recognition, ball recognition)

Substrate size
For M substrate (330×250mm)
For L substrate (410×360mm)
For E substrate (510×460mm)

Component size
Laser recognition 0402 (English 01005) chip ~ 33.5mm square component
Image recognition 1.0×0.5mm～20mm square components

Component placement speed
Chip components Best condition 0.155 seconds/chip (23,300CPH)
IPC9850 18,300CPH
IC components 4,600CPH
Actual work efficiency: The placement speed of IC components is the converted value when 36 QFP (more than 100 pins) or BGA (more than 256 balls) are mounted on the entire surface of an M-size substrate.

Component placement accuracy
Laser recognition ±0.05mm (Cpk≧1)
Image recognition ±0.04mm

Component Mounting Type
Up to 80 types (converted to 8mm tape)