Sinic-Tek SPI In-line 3D Solder Paste Inspection Model: S8080

TECHNICAL PARAMETERS:

Inspection Principle: Programmable phase contour modulation measurement techniques(PSLM PMP)

Inspection type:Volume, area, height, XY offset, shape, etc.

Defect Types:shift, excessive solder, insufficient solder, offset, deformed shape, etc.

Smallest component size: 01005.

Accuracy: XY=10 um,Height = 0.37 um.

Repeatability: height：≤1um （4 Sigma）;volume/acreage：<1%（4 Sigma）.

Maximum Loading PCB Size(X*Y): 460x460mm.

Inspection Speed: 0.42 SEC/FOV.

Fiducial Detection Time: 0.3sec/piece.

Maximum detection height:±450um（±1200umOption）.

RGB Tune patented technology.

D-lighting patented technology.

Barcode function with traceability.

Badmark transfer function to mounters.

Access IMS system functions.

Operating System Support: Windows 10 Professional (64 bit).

Five-minute programming, one-click operation.

SPC process control.