XP143E placement machine
1. SMT range: 0402(in 01005)-25x20mm, parts below 6mm in height can be attached to BGA (optional)
2. SMT speed: 0.165s/chip, 21800chips/h, automatic nozzle replacement function (optional)
3. SMT accuracy: ±0.05mm
4. Applicable substrate: up to 457x356mm, up to 50x50mm, thickness 0.3-4mm
5. Rack support: front and rear feeding, 100 stations in total, trolley refueling method, single-seat tray supplier (optional)
6. Machine size: L1500mm, W1300mm, H1408mm (excluding signal towers)
7. Machine weight: 1.8t
8. Language support: Chinese, English, Japanese
9. Program editing: support both online programming and offline programming
Description
Shipping & Delivery
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CM602 power supply
Power supply for normal use: 3-phase AC 200 V/ 220 V ±10 V, 3-phase AC 380 V/ 400 V/ 420 V/ 480 V ±20 V Frequency: 50/60 Hz
Power supply for HUB ∗ 3: Single-phase AC 100 V ~ AC 240 V Frequency: 50/60 Hz
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Supply air pressure: 0.49 MPa ~ 0.78 MPa (operating air pressure is 0.49 MPa ~ 0.54 MPa)
Supply air volume: 170 L/min (A.N.R.)
Dimensions: 2350 mm (W) × 2690 mm (D) × 1430 mm (H) (excluding 3-section signal tower and color touch panel)
quality:
Mass of the main engine: 3400 kg (140 kg for the standard configuration without the overall exchange trolley)
Overall exchange trolley mass: 140 kg (per 1)
Direct tray feeder mass: 195 kg (per 1 unit)
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Environmental conditions: Temperature: 10°C ~ 35°C Humidity: 25% RH ~ 75% RH (but water vapor does not condense)
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Specifications
| S10 | S20 | |
|---|---|---|
| Board size(with buffer unused) | Min. L50 x W30mm to Max. L1,330 x W510mm (Standard L955) | Min. L50 x W30mm to Max. L1,830 x W510mm (Standard L1,455) |
| Board size(with input or output buffer used) | Min. L50 x W30mm to Max. L420 x W510mm | - |
| Board size(with input and output buffers used) | Min. L50 x W30mm to Max. L330 x W510mm | Min. L50 x W30mm to Max. L540 x W510mm |
| Board thickness | 0.4 - 4.8mm | 0.4 - 4.8mm |
| Board flow direction | Left to right (Std) | Left to right (Std) |
| Board transfer speed | Max 900mm/sec | Max 900mm/sec |
| Placement speed (12 heads + 2 theta) Opt. Cond. | 0.08sec/CHIP (45,000CPH) | 0.08sec/CHIP (45,000CPH) |
| Placement accuracy A (μ+3σ) | CHIP +/-0.040mm | CHIP +/-0.040mm |
| Placement accuracy B (μ+3σ) | IC +/-0.025mm | IC +/-0.025mm |
| Placement angle | +/-180 degrees | +/-180 degrees |
| Z axis control / Theta axis control | AC servo motor | AC servo motor |
| Component height | Max 30mm*1 (Pre-placed components: max 25mm) | Max 30mm*1 (Pre-placed components: max 25mm) |
| Applicable components | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) |
| Component package | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray |
| Drawback check | Vacuum check and vision check | Vacuum check and vision check |
| Screen language | English, Chinese, Korean, Japanese | English, Chinese, Korean, Japanese |
| Board positioning | Board grip unit, front reference, auto conveyor width adjustment | Board grip unit, front reference, auto conveyor width adjustment |
| Component types | Max 90 types (8mm tape), 45 lanes x 2 | Max 180 types (8mm tape), 45 lanes x 4 |
| Transfer height | 900 +/- 20mm | 900 +/- 20mm |
| Machine dimensions, weight | L1250xD1750xH1420mm, Approx. 1,200kg | L1750xD1750xH1420mm, Approx. 1,500kg |
- *1 :
- Board thickness + Component height = Max 30mm
- Specifications and appearance are subject to change without prior notice.
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