| 朤科S500有导线灯带贴片机 | |
| 型号/Model | S500 |
| 外观/Appearance | |
| PCB | |
| PCB尺寸/PCB Size | 最大：1200*320mm, 最小：90*90mm Max: 1200*320mm, Min: 90*90mm |
| PCB厚度/PCB thickness | 0.5-5mm |
| PCB 定位/PCB Positioning | CCD视觉，Mark点定位 CCD visual, Mark point positioning |
| PCB传送速度/PCB Transmitting Speed | 320mm/s |
| PCB传送方向/
PCB Transmitting Direction |
前→后 Front to Back |
| 贴装/Mounting | |
| 贴装头驱动/Mounting Head Driver | 磁悬浮直线电机 Maglev linear motor |
| 贴装头数量/Mounting Head Amount | 2头 2Heads |
| 吸嘴数量/Nozzles Amount | 每头32个，共计64个 32 Pcs per head, totally 64Pcs |
| 贴装精度/Mounting Accuracy | ±0.03mm |
| 贴片速度/Mounting Speed | 250000 – 270000 CPH |
| 重复精度/Repeat Accuracy | ±0.01mm |
| 最小贴片间距/Min Mounting Gap | 6.5mm |
| 贴片元件范围/Components Range | 0805,1206,2835,3014,3528,5050,5630,5730,RGB等LED带装料; 0805,1206,2835,3014,3528,5050,5630,5730, RGB and other LED stripped material. |
| 贴片元件高度/Component Height | 10mm |
| 飞达数量/Feeder Amount | 48/64 Pcs |
| 飞达种类/Feeder Type | 双马达电动飞达 Dual motor electric feeder |
| 贴装模式/Mounting Type | 群取群贴 Group picking and group placing |
| 进出板方式/PCB Input/Output Method | 皮带传送 belt transfer |
| 导轨尺寸 Rail size | 1300*330mm |
| 系统/System | |
| 电脑系统/Computer System | Windows |
| 操作软件/Operating Software | 朤科独立开发 Independent R&D by Langke |
| 视觉系统/Visual System | 5套光学相机(可选装视觉飞拍，漏料报警)
5 sets of optical camera（option: visual inspection for missing component alarm） |
| 运动控制模块/Motion Control Module | 固高/高川运动控制卡 Googol/Gaochuan Motion control card |
| X、Y轴驱动 | 日本富士电机 Japanese Fuji Servo Motor |
| 工作要求/Working Requirement | |
| 电源/Power | 交流50HZ，三相380V±10%; 380V AC/50Hz/3 Phase |
| 最大耗电量/Max Power | 5.0 KW |
| 气压/Air Pressure | 0.5-0.8Mpa |
| 工作环境温度/Temperature | 23℃±3 |
| 外形/Dimension | |
| 外形尺寸/Dimension | 2580*2500*1550mm |
| 重量/Weight | 2197KG |
Description
Shipping & Delivery
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Specifications
| S10 | S20 | |
|---|---|---|
| Board size(with buffer unused) | Min. L50 x W30mm to Max. L1,330 x W510mm (Standard L955) | Min. L50 x W30mm to Max. L1,830 x W510mm (Standard L1,455) |
| Board size(with input or output buffer used) | Min. L50 x W30mm to Max. L420 x W510mm | - |
| Board size(with input and output buffers used) | Min. L50 x W30mm to Max. L330 x W510mm | Min. L50 x W30mm to Max. L540 x W510mm |
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| Board flow direction | Left to right (Std) | Left to right (Std) |
| Board transfer speed | Max 900mm/sec | Max 900mm/sec |
| Placement speed (12 heads + 2 theta) Opt. Cond. | 0.08sec/CHIP (45,000CPH) | 0.08sec/CHIP (45,000CPH) |
| Placement accuracy A (μ+3σ) | CHIP +/-0.040mm | CHIP +/-0.040mm |
| Placement accuracy B (μ+3σ) | IC +/-0.025mm | IC +/-0.025mm |
| Placement angle | +/-180 degrees | +/-180 degrees |
| Z axis control / Theta axis control | AC servo motor | AC servo motor |
| Component height | Max 30mm*1 (Pre-placed components: max 25mm) | Max 30mm*1 (Pre-placed components: max 25mm) |
| Applicable components | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) |
| Component package | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray |
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| Screen language | English, Chinese, Korean, Japanese | English, Chinese, Korean, Japanese |
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| Component types | Max 90 types (8mm tape), 45 lanes x 2 | Max 180 types (8mm tape), 45 lanes x 4 |
| Transfer height | 900 +/- 20mm | 900 +/- 20mm |
| Machine dimensions, weight | L1250xD1750xH1420mm, Approx. 1,200kg | L1750xD1750xH1420mm, Approx. 1,500kg |
- *1 :
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- Specifications and appearance are subject to change without prior notice.
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Specifications
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- Spindle & Speed
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Specifications
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|---|---|---|---|
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| Nozzles (per 1 head unit) | 18 | 10 | 5 |
| Applicable components | 0201mm to W12 x L12mm, Height 6.5mm or less | 0201mm to W55 x L100mm, Height 15mm or less | 03015mm to W55 x L100mm, Height 30mm or less |
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| Power supply | 3-Phase AC 200/208/220/240/380/400/416V +/-10% 50/60Hz | ||
| Air supply source | 0.45MPa or more, in clean, dry state | ||
| External dimension (excluding projections) | L1,374 x W1,948 x H1,445mm | ||
| Weight | 2-beam : Approx. 2,250kg (Main unit only), 1-beam : Approx. 2,150kg (Main unit only) | ||
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Program data: Points Max. 10000 points
CM602 power supply
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Specifications
| YC8 | ||
|---|---|---|
| Applicable PCB | L50 x W50mm to L330 x W360mm *1 | |
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| Power supply | 3-Phase AC 200/208/220/240/380/400/416V +/-10% 50/60Hz | |
| Air supply source | 0.45MPa or more, in clean, dry states | |
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| Weight | Approx. 1,000kg (Main unit only) ATS15 : Approx. 120kg | |
- *1
- Please consult us separately for maximum board sizes.
- *2
- Consult us separately regarding component sizes outside the specifications.
- Specifications and appearance are subject to change without prior notice.
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